Thermoformed insulation panel for radiant floor systems.
Consisting of expanded polystyrene foam (EPS150) with black thermoformed polystyrene protection layer.
Laying pitch: multiples of 50 mm.
Thermal conductivity: 0,034 W/m K.
For Ø 15÷18 mm pipes.
Dimensions: 1400x800 mm.
THERMAL RESISTENCE (EN 1264-3)
R982QY043: 0,44 (m²K)/W
R982QY115: 0,80 (m²K)/W
| Code | Size |  |
 |
BIM(revit) | CAD(dxf) | Certification |
|---|---|---|---|---|---|---|
| R982QY043 | T50 - h37 | 20,16 | 0 | - | - | |
| R982QY115 | T50 - h50 | 13,44 | 0 | - | - |
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